![[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow]()
[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflowHu Guojun, ; Tay, A.A.O. · 2005