[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - A waveguide diplexer based on E-plane T-junctionChen, Cheng; Chen, Liu; Zhao, Peng · 2014

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of annealing after copper plating on the pumping behavior of through silicon viasJi, Liang; Jing, Xiangmeng; Xue, Kai; Xu, Cheng; He, Hongwen; Zhang, Wenqi · 2014

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effect of thermal annealing on TSV Cu protrusion and local stressJing, Xiangmeng; He, Hongwen; Ji, Liang; Xu, Cheng; Xue, Kai; Su, Meiying; Song, Chongshen; Yu, Daquan; Cao, Liqiang; Zhang, Wenqi; Shangguan, Dongkai · 2014