Psychological and physiological responses to stress: The right hemisphere and the hypothalamo-pituitary-adrenal axis, an inquiry into problems of human bonding
- 作者James P. Henry
- 卷第28卷
- 期第4期
- 印刷ISSN1053-881X
- 电子ISSN1936-3567
- 文件大小1654.97KB
- 发表时间1993-1012
- DOI10.1007/bf02690935
- 页码369-387
Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder jointsLai, Yanqing; Hu, Xiaowu; Li, Yulong; Jiang, Xiongxin · Journal of Materials Science: Materials in Electronics · 2018
The Thermal-Aging Effect on the Microstructure Evolution and Shear Strength of the Sn-Rich Au-Sn Soldering between Altic and Si Substrate in MicroelectronicsAthichalinthorn, Panaaek; Darayen, Jidsucha; Puttichaem, Wachira; Techapiesancharoenkij, Ratchatee; Lohwongwatana, Boonrat · Key Engineering Materials · 2017
[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Microstructure evolution and shear strength of eutectic Sn-9Zn and Sn-0.7Cu lead-free BGA solder ballsWu, C.M.L.; Law, C.M.T. · 2004
[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Microstructure evolution and shear strength of Sn-3.5Ag-RE lead-free BGA solder ballsLaw, C.M.T.; Wu, C.M.L. · 2004
Corrosion characterization of tin–lead and lead free solders in 3.5 wt.% NaCl solutionDezhi Li; Paul P. Conway; Changqing Liu · 2008
Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnectsDezhi Li; Changqing Liu; Paul P. Conway · 2005
Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCBLi, Dezhi; Liu, Changqing; Conway, Paul P. · Journal of Electronic Packaging · 2008
Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloysLi, Dezhi; Liu, Changqing; Conway, Paul P. · Circuit World · 2005
[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder AlloysLiu, Changqing; Hutt, David A.; Li, Dezhi; Conway, Paul P. · 2005