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[IEEE 2012 IEEE 9th International Symposium on Biomedical Imaging (ISBI 2012) - Barcelona, Spain (2012.05.2-2012.05.5)] 2012 9th IEEE International Symposium on Biomedical Imaging (ISBI) - Endocardial motion estimation from electro-anatomical dataPorras, A. R.; Piella, G.; Hoogendoorn, C.; Andreu, D.; Berruezo, A.; Frangi, A. F. · 2012
[IEEE 2012 IEEE International Symposium on Electrical Insulation (ISEI) - San Juan, PR, USA (2012.06.10-2012.06.13)] 2012 IEEE International Symposium on Electrical Insulation - Detection of AC corona discharges using an electro-optic E-field sensorVolat, C.; Duvillaret, L.; Gaborit, G. · 2012
[IEEE 2012 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA, USA (2012.04.15-2012.04.19)] 2012 IEEE International Reliability Physics Symposium (IRPS) - On the electro-mechanical reliability of NEMFET as an analog/digital switchJain, Ankit; Islam, A. E.; Alam, M. A. · 2012
[IEEE 2012 IEEE International Symposium on Electrical Insulation (ISEI) - San Juan, PR, USA (2012.06.10-2012.06.13)] 2012 IEEE International Symposium on Electrical Insulation - Preliminary study on infrared spectral characteristics of mineral oil impregnated polymer materials under electro-thermal agingHe, Dongxin; Wang, Wei; Yang, Kai; Chen, Shengke; Yue, Caipeng · 2012
[IEEE 2012 IEEE 13th International Symposium on Computational Intelligence and Informatics (CINTI) - Budapest, Hungary (2012.11.20-2012.11.22)] 2012 IEEE 13th International Symposium on Computational Intelligence and Informatics (CINTI) - Simulation of rolling mill's electro-hydraulic gap adjustment systemKovari, A.; Fodor, D. · 2012
[IEEE 2012 Sixth International Symposium on Telecommunications (IST) - Tehran, Iran (2012.11.6-2012.11.8)] 6th International Symposium on Telecommunications (IST) - An ultra-compact electro-optic plasmonic switchKhammari, M.; Granpayeh, N. · 2012
[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Advanced fault isolation technique using electro-optical terahertz pulse reflectometryTay, M. Y.; Cao, L.; Venkata, M.; Tran, L.; Donna, W.; Qiu, W.; Alton, J.; Taday, P. F.; Lin, M. · 2012
[IEEE 2012 International Symposium on Micro-NanoMechatronics and Human Science (MHS) - Nagoya, Aichi, Japan (2012.11.4-2012.11.7)] 2012 International Symposium on Micro-NanoMechatronics and Human Science (MHS) - 3D cell assembly based on electro deposition of calcium alginateShen, Yajing; Nakajima, Masahiro; Hu, Chengzhi; Yue, Tao; Tajima, Hirotaka; Fukuda, Toshio · 2012
Fast Method for an Accurate and Efficient Nonlinear Signaling AnalysisJiao, Dan; Zhu, Jianfang Olena · IEEE Transactions on Electromagnetic Compatibility · 2017
Solution of the Electric Field Integral Equation When It Breaks DownZhu, Jianfang; Omar, Saad; Jiao, Dan · IEEE Transactions on Antennas and Propagation · 2014
A Theoretically Rigorous Full-Wave Finite-Element-Based Solution of Maxwell's Equations From dc to High FrequenciesJianfang Zhu; Dan Jiao · 2010
Eliminating the Low-Frequency Breakdown Problem in 3-D Full-Wave Finite-Element-Based Analysis of Integrated CircuitsJianfang Zhu; Dan Jiao · 2010
Fast Full-Wave Solution That Eliminates the Low-Frequency Breakdown Problem in a Reduced System of Order OneJianfang Zhu, ; Dan Jiao, · IEEE Transactions on Components, Packaging and Manufacturing Technology · 2012
A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect StructuresDan Jiao, ; Jianfang Zhu, ; Chakravarty, S. · IEEE Transactions on Advanced Packaging · 2008
[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Fast algorithm for nonlinear signaling analysisJiao, Dan; Zhu, Jianfang Olena · 2016
A Unified Finite-Element Solution From Zero Frequency to Microwave Frequencies for Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect StructuresJianfang Zhu, ; Dan Jiao, · IEEE Transactions on Advanced Packaging · 2008