![[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - GHz flip chip interconnect experiments]()
[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - GHz flip chip interconnect experimentsBoustedt, K.; Karnfelt, C. · 2004