Using trust for detecting deceitful agents in artificial societies
- 期刊名称Applied Artificial Intelligence
- 作者Schillo, Michael; Funk, Petra; Rovatsos, Michael
- 卷第14卷
- 期第8期
- 印刷ISSN0883-9514
- 电子ISSN1087-6545
- 文件大小332.77KB
- 发表时间2000-09
- DOI10.1080/08839510050127579
- 页码825-848
[IEEE Proceedings Electronic Components and Technology, 2005. ECTC '05. - Lake Buena Vista, FL, USA (2005.05.31-2005.06.3)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Proceedings 55th Electronic Components & Technology Conference2005
[IEEE 2005 Proceedings. 55th Electronic Components and Technology Conference - Lake Buena Vista, FL (2005.05.31-2005.06.3)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Copyright page2005
[IEEE Proceedings Electronic Components and Technology, 2005. ECTC '05. - Lake Buena Vista, FL, USA (2005.05.31-2005.06.3)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Professional development courses for the 55th ECTC2005
[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Determination of silicon die strengthTsai, M.Y.; Lin, C.S. · 2005
[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Cytotoxicity of COB materialsUhlemann, J.; Schindler, S.; Schlottig, G.; Drechsler, M.; Starcke, S.; Vollmer, G.; Wolter, K.-J. · 2005
[IEEE 2005 Proceedings. 55th Electronic Components and Technology Conference - Lake Buena Vista, FL (2005.05.31-2005.06.3)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Novel Hermetic Wafer-Level-Packaging Technology using Low-Temperature PassivationLeib, J.; Mund, D.; Topper, M. · 2005
[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Shear deformation of lead free solder jointsDarveaux, R. · 2005
[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Reliability prediction in electronic packages using molecular simulationFan, H.B.; Wong, C.K.Y.; Yuen, M.M.F. · 2005