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Difference in Annealing Characteristics of Nanostructured Copper Alloys Processed by Accumulative Roll Bonding

Difference in Annealing Characteristics of Nanostructured Copper Alloys Processed by Accumulative Roll Bonding

Lee, Seong Hee; Han, Seung Zeon; Lim, Cha Yong
  • 期刊名称Solid State Phenomena
  • 作者Lee, Seong Hee; Han, Seung Zeon; Lim, Cha Yong
  • 电子ISSN1662-9779
  • 文件大小3305.09KB
  • 发表时间2007
  • DOI10.4028/www.scientific.net/SSP.124-126.1373
  • 页码1373-1376
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