[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Comparison between ENA and ENEPIG surface finish for high density TBGA packagePun, Kelvin; Islam, M. N.; Ng, Tin Wing · 2014

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Development of void free, high reliability underfill encapsulated fine pitch system on flex packagesPun, Kelvin; Sharma, Anupam; Singh, Amandeep; Islam, M. N.; Ng, Tin Wing · 2014

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Foldable substrates for wearable electronicsPun, Kelvin; Islam, M. N.; Ng, Tin Wing · 2014

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - ENEG and ENEPIG surface finish for long term solderabilityPun, Kelvin; Islam, M. N.; Ng, Tin Wing · 2014