ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - Metal Surface Preparation for Wafer Bonding with Point of Use Wet Chemistries
- 作者Sood, Sumant; Farrens, Shari; Rardin, Anthony; Kirk, Simon; Pettit, Dave
- 印刷ISSN1938-5862
- 文件大小867.94KB
- 发表时间2010
- DOI10.1149/1.3483490
- 页码17-26
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