![[IEEE Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (12-13 June 1989)] Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Dielectric film deposition by atmospheric pressure and low temperature CVD using TEOS, ozone, and new organometallic doping sources]()
[IEEE Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (12-13 June 1989)] Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Dielectric film deposition by atmospheric pressure and low temperature CVD using TEOS, ozone, and new organometallic doping sourcesNishimoto, Y.; Tokumasu, N.; Fujino, K.; Maeda, K. · 1989