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[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Copyright2009
[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Cover2009
[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Contents2009
[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - ForewordIllyefalvi-Vitez, Zsolt · 2009
[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Authors index2009
[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Electrical / mechanical / thermal design integrationMan, Lucian; Pitica, Dan; Zolog, Monica · 2009
[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Remote EEG MonitoringGerigan, C.; Ogrutan, P.; Aciu, L. · 2009
[IEEE 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Gyula, Hungary (2009.09.17-2009.09.20)] 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) - Impedance of Adhesive JointsMach, Pavel; Kolar, Jiri · 2009
[IEEE 2009 32nd International Spring Seminar on Electronics Technology (ISSE) - Brno, Czech Republic (2009.05.13-2009.05.17)] 2009 32nd International Spring Seminar on Electronics Technology - Data mining in electronics packagingMeyer, Sebastian; Wohlrabe, Heinz; Wolter, Klaus-Jurgen · 2009
[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Reliability Qualification of Flexible Printed Circuits with Common and New MethodsDetert, Markus; Ernst, Daniel; Zerna, Thomas; Wohlrabe, Heinz; Wolter, Klaus-jurgen · 2006
[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Practical Usage of Design of Experiments in the Production of SMT-BoardsWohlrabe, Heinz; Wolter, Klaus-jurgen · 2006
[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - R1 — A reliability comparison study between 14 lead free alloysWohlrabe, Heinz; Reichelt, Gundolf · 2013
[IEEE 2009 32nd International Spring Seminar on Electronics Technology (ISSE) - Brno, Czech Republic (2009.05.13-2009.05.17)] 2009 32nd International Spring Seminar on Electronics Technology - Warpage measurements of SMD-components under soldering conditionsWohlrabe, Heinz · 2009
[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Process and material effects on BGA board level solder joint reliabilityMeyer, Sebastian; Metasch, Rene; Schwerz, Robert; Wohlrabe, Heinz; Wolter, Klaus-Jurgen · 2011
[IEEE 2016 39th International Spring Seminar on Electronics Technology (ISSE) - Pilsen, Czech Republic (2016.5.18-2016.5.22)] 2016 39th International Spring Seminar on Electronics Technology (ISSE) - Simulation based optimization of a SMD-assembling processWohlrabe, Heinz; Fritzsche, Harald; Lungen, Sebastian · 2016
[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Impact of Warpage Effects on Quality and Reliability of Solder JointsAlbrecht, Oliver; Wohlrabe, Heinz; Meier, Karsten · 2019