![[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Stress characterization of electroplated gold layers for low temperature surface micromachining]()
[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Stress characterization of electroplated gold layers for low temperature surface micromachiningMargesin, B.; Bagolini, A.; Guarnieri, V.; Giacomozzi, F.; Faes, A.; Pal, R.; Decarli, M. · 2003