Reliability aspects of electronic devices for advanced requirements
- 期刊名称Circuit World
- 作者Schüßler, Florian; Rösch, Michael; Hörber, Johannes; Feldmann, Klaus
- 卷第34卷
- 期第3期
- 印刷ISSN0305-6120
- 文件大小301.58KB
- 发表时间2008-08-22
- DOI10.1108/03056120810896245
- 页码23-30
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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Calibration of Equivalent Finite Element Model for Packaged Printed Circuit Board by Experimental Modal AnalysisLee, Ying-Chih; Wang, Bor-Tsuen; Lail, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng · 2008
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Finite element modelling of printed circuit boards (PCBs) for structural analysisLee, Miky · Soldering & Surface Mount Technology · 1998
Double blending: online theory with on-campus practice in photography instructionAbrahmov, Shlomo Lee; Ronen, Miky · Innovations in Education and Teaching International · 2008
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1.66 “To the Bones:” A Review of the Medical and Psychiatric Complications of Eating DisordersAdikey, Archana; Kaushal, Miky; Stevens, Lee · Journal of the American Academy of Child & Adolescent Psychiatry · 2018
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[IEEE 2018 IEEE International Reliability Physics Symposium (IRPS) - Burlingame, CA (2018.3.11-2018.3.15)] 2018 IEEE International Reliability Physics Symposium (IRPS) - Weibull cumulative distribution function (CDF) analysis with life expectancy endurance test result of power window switchLee, Miky; Kim, K.; Lim, D.; Cho, D.; Han, Ck. · 2018
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