[IEEE 2009 IEEE International Symposium on Industrial Electronics (ISIE 2009) - Seoul, South Korea (2009.07.5-2009.07.8)] 2009 IEEE International Symposium on Industrial Electronics - Fluidic systems in Printed Circuit Boards
- 作者Gassmann, Stefan; Pagel, Lienhard
- 文件大小8238.93KB
- 发表时间2009
- DOI10.1109/isie.2009.5213143
- 页码597-602
[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Design for ReliabilityTurner, Timothy · 2006
[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - A Spectroscopic SEM: First ResultsOsterberg, Mans; Khursheed, Anjam · 2006
[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Advanced Test Methodology and Strategies for SemiconductorsWest, Burnell · 2006
[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Future of Nano-CMOS Technology and Its ProductionIwai, Hiroshi · 2006
[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - The rules of the Rue Morgue: a decade laterMura, G.; Vanzi, M.; Cassanelli, G.; Fantini, F. · 2006
[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Application of EDS Technique for OSP Film Thickness MeasurementProng, K.; Sirarat, K. · 2006
[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Diffractive lenses for high resolution laser based failure analysisZachariasse, Frank; Goossens, Martijn · 2006
[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Lead frame Hillock-Induced Silicon CrackFlores, R.C.; Fabia, M.G.; Nabong, M.T.; Soria, A.O.; Gabunas, C.B. · 2006