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[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Deposition of WN/sub x/C/sub y/ thin films by ALCVD/spl trade/ method for diffusion barriers in metallizationWei-Min Li, ; Kai Elers, ; Juhana Kostamo, ; Kaipio, S.; Huotari, H.; Soininen, M.; Soininen, P.J.; Tuominen, M.; Haukka, S.; Smith, S.; Besling, W. · 2002

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[IEEE 4th International Conference on Solid-State and IC Technology - Beijing, China (24-28 Oct. 1995)] Proceedings of 4th International Conference on Solid-State and IC Technology - A modified model of high-T/sub c/ superconducting interconnect propagation characteristics for VLSI packagingJinfeng Kang, ; Ruqi Han, ; Yangyuan Wang, · 1995

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