Impact of irregular geometries on low-k dielectric breakdown
- 作者Muhammad Bashir; Linda Milor; Dae Hyun Kim; Sung Kyu Lim
- 卷第51卷
- 印刷ISSN0026-2714
- 文件大小631.36KB
- 发表时间2011
- DOI10.1016/j.microrel.2011.07.005
- 页码1582-1586
Electrical characterization and reliability study of HEMTs on composite substrates under high electric fieldsTazzoli, A.; Meneghesso, G.; Zanon, F.; Danesin, F.; Zanoni, E.; Bove, P.; Langer, R.; Thorpe, J. · Microelectronics Reliability · 2008
SPIE Proceedings [SPIE MOEMS-MEMS 2008 Micro and Nanofabrication - San Jose, CA (Saturday 19 January 2008)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII - <title>Experimental study of electrical breakdown in MEMS devices with micrometer scale gaps</title>Carazzetti, P.; Renaud, Ph.; Shea, H. R.; Hartzell, Allyson L.; Ramesham, Rajeshuni · 2008
[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon viasDixit, Pradeep; Viljanen, Heikki; Salonen, Jaakko; Suni, Tommi; Molarius, Jyrki; Monnoyer, Philippe · 2013