Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests
- 作者Teng Wang; Si Chen; Di Jiang; Yifeng Fu; Jeppson, K.; Lilei Ye; Johan Liu
- 卷第33卷
- 期第3期
- 文件大小302.77KB
- 发表时间2012
- DOI10.1109/led.2011.2177804
- 页码420-422
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