![[IEEE 2013 IEEE Conference on Reliability Science for Advanced Materials and Devices (RSAMD) - Golden, CO, USA (2013.2.24-2013.2.25)] 2013 IEEE Conference on Reliability Science for Advanced Materials and Devices - Electrical conduction effect on reliability of low-k dielectric in Cu interconnect]()
[IEEE 2013 IEEE Conference on Reliability Science for Advanced Materials and Devices (RSAMD) - Golden, CO, USA (2013.2.24-2013.2.25)] 2013 IEEE Conference on Reliability Science for Advanced Materials and Devices - Electrical conduction effect on reliability of low-k dielectric in Cu interconnectLin, Mingte; Juan, Alex; Su, K. C. · 2013