Steady-state models of photosynthesis
- 期刊名称Plant, Cell & Environment
- 作者VON CAEMMERER, SUSANNE
- 卷第36卷
- 期第9期
- 印刷ISSN0140-7791
- 文件大小710.01KB
- 发表时间2013-09
- DOI10.1111/pce.12098
- 页码1617-1630
High-Efficient Chip to Wafer Self-Alignment and Bonding Applicable to MEMS-IC Flexible IntegrationLu, Jian; Nakano, Yuta; Takagi, Hideki; Maeda, Ryutaro · IEEE Sensors Journal · 2013
[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Size-free MEMS-IC high-efficient integration by using carrier wafer with self-assembled monolayer (SAM) fine patternLu, Jian; Takagi, Hideki; Nakano, Yuta; Maeda, Ryutaro · 2013
[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - High-efficient and high-accurate chip to wafer bonding for size-free MEMS-IC integration by using fine patterned self-assembled monolayerLu, Jian; Nakano, Yuta; Takagi, Hideki; Maeda, Ryutaro · 2012
Optimization of MEMS capacitive accelerometerBenmessaoud, Mourad; Nasreddine, Mekkakia Maaza · Microsystem Technologies · 2013
Novel microstructured evaporation deviceWibel, Wolf; Maikowske, Stefan; Brandner, Juergen J. · Microsystem Technologies · 2015
HAMR HDD shock responsesHuang, Lidu; Suzuki, Kenzi; Huang, Fu-Ying; Hirano, Toshiki; Stipe, Barry · Microsystem Technologies · 2014
Tools for ultrasonic hot embossingLiao, S.; Gerhardy, C.; Sackmann, J.; Schomburg, W. K. · Microsystem Technologies · 2015
ForewordBharat Bhushan · Microsystem Technologies · 2014
Hybrid micro electrostatic actuatorHailu, Zewdu; He, Siyuan; Ben Mrad, Ridha · Microsystem Technologies · 2016
Special issue WaferBond’13Knechtel, Roy; Niklaus, Frank; Michel, Bernd · Microsystem Technologies · 2015
Editorial special issue HARMNST 2013Mohr, Jürgen; Göttert, Jost; Michel, Bernd · Microsystem Technologies · 2014