![[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias]()
[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon viasDixit, Pradeep; Viljanen, Heikki; Salonen, Jaakko; Suni, Tommi; Molarius, Jyrki; Monnoyer, Philippe · 2013