[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Maximizing Data Center Energy Efficiency by Utilizing New Thermal Management and Acoustic Control MethodologyMatteson, Jason A.; Vallury, Aparna; Medlin, Billy · 2013

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Optimization Algorithms for Energy-Efficient Data CentersHamann, Hendrik F. · 2013

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - On the Thermal Management Challenges in Next Generation Handheld DevicesWagner, Guy R.; Maltz, William · 2013

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Development of Plate Heat Pipes for the Thermal Management of Power ElectronicsAbe, Yoshiyuki; Nakajima, Akira; Maeda, Yoshihiko; Shimose, Makoto · 2013

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Comparative Thermal and Energy Analysis of a Hybrid Cooling Data Center With Rear Door Heat ExchangersGao, Tianyi; Samadiani, Emad; Sammakia, Bahgat; Schmidt, Roger · 2013

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Transient Thermal Response of Servers Through Air Temperature MeasurementsErden, Hamza Salih; Khalifa, H. Ezzat; Schmidt, Roger R. · 2013

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Energy efficient thermal management of electronic components using solid liquid phase change materialsYoo, D. · 2002

STEM CELLSJoshi, K.; Gupta, S.; Mazumder, S.; Okemoto, Y.; Angenieux, B.; Kornblum, H.; Nakano, I.; Synowitz, M.; Kumar, J.; Petrosino, S.; Imperatore, R.; Smith, E.; Wendt, P.; Erdmann, B.; Nuber, U.; Nuber, U.; Matiash, V.; Chirasani, S.; Cristino, L.; DiMarzo, V.; Kettenmann, H.; Glass, R.; Soroceanu, L.; Matlaf, L.; Cobbs, C.; Kim, Y.-W.; Kim, S. H.; Kwon, C.; Han, D.-y.; Kim, E. H.; Chang, J. H.; Liu, J.-L.; Kim, Y. H.; Kim, S.; Long, P. M.; Viapiano, M. S.; Jaworski, D. M.; Kanemura, Y.; Shofuda, T.; Kanematsu, D.; Matsumoto, Y.; Yamamoto, A.; Nonaka, M.; Moriuchi, S.; Nakajima, S.; Suemizu, H.; Nakamura, M.; Okada, Y.; Okano, H.; Yamasaki, M.; Price, R. L.; Song, J.; Bingmer, K.; Zimmerman, P.; Rivera, A.; Yi, J.-Y.; Cook, C.; Chiocca, E. A.; Kwon, C.-H.; Kang, S.-G.; Shin, H.-D.; Mok, H.-S.; Park, N.-R.; Sim, J. K.; Shin, H. J.; Park, Y. K.; Jeun, S. S.; Hong, Y.-K.; Lang, F. F.; McKenzie, B. A.; Zemp, F. J.; Lun, X.; Narendran, A.; McFadden, G.; Kurz, E.; Forsyth, P.; Talsma, C. E.; Flack, C. G.; Zhu, T.; He, X.; Soules, M.; Heth, J. A.; Muraszko, K.; Fan, X.; Chen, L.; Guerrero-Cazares, H.; Noiman, L.; Smith, C.; Beltran, N.; Levchenko, A.; Quinones-Hinojosa, A.; Peruzzi, P.; Godlewski, J.; Lawler, S. E.; Chiocca, E. A.; Sarkar, S.; Doring, A.; Lun, X.; Wang, X.; Kelly, J.; Hader, W.; Dunn, J. F.; Kinniburgh, D.; Robbins, S.; Forsyth, P.; Cairncross, G.; Weiss, S.; Yong, V. W.; Vollmann-Zwerenz, A.; Velez-Char, N.; Jachnik, B.; Ramm, P.; Leukel, P.; Bogdahn, U.; Hau, P.; Kim, S.-H.; Lee, M. K.; Chwae, Y.-J.; Yoo, B. C.; Kim, K.-H.; Kristoffersen, K.; Stockhausen, M.- T.; Poulsen, H. S.; Kaluzova, M.; Machaidze, R.; Wankhede, M.; Hadjipanayis, C. G.; Romane, A. M.; Sim, F. J.; Wang, S.; Chandler-Militello, D.; Li, X.; Al Fanek, Y.; Walter, K.; Johnson, M.; Achanta, P.; Quinones-Hinojosa, A.; Goldman, S. A.; Shinojima, N.; Hossain, A.; Takezaki, T.; Gumin, J.; Gao, F.; Nwajei, F.; Cheung, V.; Figueroa, J.; Lang, F. F.; Pellegatta, S.; Orzan, F.; Anghileri, E.; Guzzet · Neuro-Oncology · 2011