Assumptions and associations under pressure
- 期刊名称Anaesthesia
- 作者Choi, S. W.; Wong, G. T. C.
- 卷第73卷
- 期第7期
- 印刷ISSN0003-2409
- 文件大小103.82KB
- 发表时间2018-07
- DOI10.1111/anae.14325
- 页码901-903
Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink ClampingRoberts, Jordan C.; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep · Journal of Electronic Packaging · 2012
[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Measurement of die stresses in microprocessor packaging due to thermal and power cyclingRoberts, Jordan; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep · 2012
[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Characterization of microprocessor chip stress distributions during component packaging and thermal cyclingRoberts, Jordan; Hussain, Safina; Rahim, M. Kaysar; Motalab, Mohammad; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep; Zhang, Ron · 2010
[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Measurement of die stress distributions in flip chip CBGA packagingRoberts, Jordan; Hussain, Safina; Rahim, M. Kaysar; Motalab, Mohammad; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep; Zhang, Ron · 2010