Nuclear Forces and Nuclear Energetics
- 期刊名称Physical Review C
- 作者Ingber, Lester
- 卷第1卷
- 期第1期
- 印刷ISSN0556-2813
- 文件大小923.22KB
- 发表时间1970-1-1
- DOI10.1103/physrevc.1.112
- 页码112-122
A 130-mm2, 256-Mbit NAND flash with shallow trench isolation technologyImamiya, K.; Sugiura, Y.; Nakamura, H.; Himeno, T.; Takeuchi, K.; Ikehashi, T.; Kanda, K.; Hosono, K.; Shirota, R.; Aritome, S.; Shimizu, K.; Hatakeyama, K.; Sakui, K. · 1999
Design methodology of a robust ESD protection circuit for STI process 256 Mb NAND flash memoryIkehashi, T.; Imamiya, K.; Sakui, K. · IEEE Transactions on Electronics Packaging Manufacturing · 2000
[Japan Soc. Appl. Phys 1999 Symposium on VLSI Circuits. Digest of Technical Papers - Kyoto, Japan (17-19 June 1999)] 1999 Symposium on VLSI Circuits. Digest of Papers (IEEE Cat. No.99CH36326) - A source-line programming scheme for low voltage operation NAND flash memoriesTakeuchi, K.; Satoh, S.; Imamiya, K.; Sugiura, Y.; Nakamura, H.; Himeno, T.; Ikehashi, T.; Kanda, K.; Hosono, K.; Sakui, K. · 1999
[ESD Assoc Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 1999 - Orlando, FL, USA (28-30 Sept. 1999)] Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 1999 (IEEE Cat. No.99TH8396) - Design methodology of a robust ESD protection circuit for STI process 256 Mb NAND memoryIkehashi, T.; Imamiya, K.; Sakui, K. · 1999
[IEEE 1999 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC. First Edition - San Francisco, CA, USA (15-17 Feb. 1999)] 1999 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC. First Edition (Cat. No.99CH36278) - A 130 mm/sup 2/ 256 Mb NAND flash with shallow trench isolation technologyImamiya, K.; Sugiura, Y.; Nakamura, H.; Himeno, T.; Takeuchi, K.; Ikehashi, T.; Kanda, K.; Hosono, K.; Shirota, R.; Aritome, S.; Shimizu, K.; Hatakeyama, K.; Sakui, K. · 1999
Business Benefits From Applied EcoDesigndeCaluwe, N. · IEEE Transactions on Electronics Packaging Manufacturing · 2004
Acoustic Monitoring of Electrochemical DepositionWilliams, F.R.; May, G.S. · IEEE Transactions on Electronics Packaging Manufacturing · 2004
Foreword Polytronic Special SectionMorris, J.E. · IEEE Transactions on Electronics Packaging Manufacturing · 2005
Analysis of process modelsZakarian, A.; Kusiak, A. · IEEE Transactions on Electronics Packaging Manufacturing · 2000
List of ReviewersIEEE Transactions on Electronics Packaging Manufacturing · 2008
Feature transformation methods in data miningKusiak, A. · IEEE Transactions on Electronics Packaging Manufacturing · 2001
Annotated tin whisker bibliography and anthologyGalyon, G.T. · IEEE Transactions on Electronics Packaging Manufacturing · 2005
Foreword Special Issue on Tin WhiskersGedney, R.W. · IEEE Transactions on Electronics Packaging Manufacturing · 2005