SPIE Proceedings [SPIE Dry Etch Technology - San J, United States (Monday 9 September 1991)] Dry Etch Technology - Wafer charging in different types of plasma etchers
- 作者Namura, Takashi; Uchida, Hirofumi; Okada, Hiroyuki; Koshio, Atsushi; Nakagawa, Satoshi; Todokoro, Yoshihiro; Inoue, Morio; Ranadive, Deepak
- 卷第1593卷
- 印刷ISSN0277-786X
- 文件大小742.27KB
- 发表时间1992
- DOI10.1117/12.56911
- 页码11-22
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