![[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration]()
[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D IntegrationSaito, Naoki; Murata, Naokazu; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo · 2011