Troubled Natures: Waste, Environment, Japan
- 期刊名称Japanese Studies
- 作者Bennett, Brett
- 卷第32卷
- 期第3期
- 印刷ISSN1037-1397
- 电子ISSN1469-9338
- 文件大小65.46KB
- 发表时间2012-12
- DOI10.1080/10371397.2012.708962
- 页码486-489
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Full-chip reliability analysisRochel, S.; Steele, G.; Lloyd, J.R.; Hussain, S.Z.; Overhauser, D. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Chip scale package (CSP) solder joint reliability and modelingAmagai, M. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Effects of advanced processes on hot carrier reliabilityAur, S.; Grider, T.; McNeil, V.; Holloway, T.; Eklund, R. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Assessing circuit-level hot-carrier reliabilityJiang, W.; Le, H.; Chung, J.; Kopley, T.; Marcoux, P.; Dai, C. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Latchup in CMOS technologyHargrove, M.J.; Voldman, S.; Gauthier, R.; Brown, J.; Duncan, K.; Craig, W. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Statistics of microstructure for via metallization and implication for electromigration reliabilityToyoda, H.; Wang, P.-H.; Ho, P.S. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Dynamics of backside wafer level microprobingChiang, C.-L.; Hurley, D.T. · 1998