The 2014 Danish references from birth to 20 years for height, weight and body mass index
- 期刊名称Acta Paediatrica
- 作者Tinggaard, Jeanette; Aksglaede, Lise; Sørensen, Kaspar; Mouritsen, Annette; Wohlfahrt-Veje, Christine; Hagen, Casper P; Mieritz, Mikkel G; Jørgensen, Niels; Wolthers, Ole D; Heuck, Carsten; Petersen, Jørgen Holm; Main, Katharina M; Juul, Anders
- 卷第103卷
- 期第2期
- 印刷ISSN0803-5253
- 文件大小1613.76KB
- 发表时间2014-02
- DOI10.1111/apa.12468
- 页码214-224
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Full-chip reliability analysisRochel, S.; Steele, G.; Lloyd, J.R.; Hussain, S.Z.; Overhauser, D. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Chip scale package (CSP) solder joint reliability and modelingAmagai, M. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Effects of advanced processes on hot carrier reliabilityAur, S.; Grider, T.; McNeil, V.; Holloway, T.; Eklund, R. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Assessing circuit-level hot-carrier reliabilityJiang, W.; Le, H.; Chung, J.; Kopley, T.; Marcoux, P.; Dai, C. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Latchup in CMOS technologyHargrove, M.J.; Voldman, S.; Gauthier, R.; Brown, J.; Duncan, K.; Craig, W. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Statistics of microstructure for via metallization and implication for electromigration reliabilityToyoda, H.; Wang, P.-H.; Ho, P.S. · 1998
[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Dynamics of backside wafer level microprobingChiang, C.-L.; Hurley, D.T. · 1998