![[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Impacts of Cu contamination in 3D integration process on memory retention characteristics in thinned DRAM chip]()
[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Impacts of Cu contamination in 3D integration process on memory retention characteristics in thinned DRAM chipLee, Kangwook; Tanikawa, Seiya; Naganuma, Hideki; Bea, Jichel; Murugesan, Mariappine; Fukushima, Takafumi; Tanaka, Tetsu; Koyanagi, Mitsumasa · 2014